इलेक्ट्रॉनिक पुर्ज़े : K4H511638B-TCLB0

निर्माता : SAMSUNG[Samsung semiconductor]

पैकिंग :

पिन :

वर्णन : 512Mb B-die SDRAM Specification

तापमान : न्यूनतम °C | मैक्स °C

Datasheet : K4H511638B-TCLB0 PDF

• K4H511638B-G
• K4H511638B-GC/LA2
• K4H511638B-GC/LB0
• K4H511638B-GC/LB3
• K4H511638B-GC/LCC
• K4H511638B-GCLA2
• K4H511638B-GCLB0
• K4H511638B-GCLB3
• K4H511638B-GCLCC
• K4H511638B-TC/LA2
• K4H511638B-TC/LB0
• K4H511638B-TC/LB3
• K4H511638B-TC/LCC
• K4H511638B-TCA0
• K4H511638B-TCA2