इलेक्ट्रॉनिक पुर्ज़े : K4H1G0438M-UCLB3

निर्माता : SAMSUNG[Samsung semiconductor]

पैकिंग :

पिन :

वर्णन : M-die SDRAM Specification TSOP-II with Pb-Free (RoHS compliant)

तापमान : न्यूनतम °C | मैक्स °C

Datasheet : K4H1G0438M-UCLB3 PDF

• K4H1G0438M-LA2
• K4H1G0438M-LB0
• K4H1G0438M-LB3
• K4H1G0438M-TC/LA2
• K4H1G0438M-TC/LB0
• K4H1G0438M-TC/LB3
• K4H1G0438M-TCA0
• K4H1G0438M-TCA2
• K4H1G0438M-TCB0
• K4H1G0438M-TCLA2
• K4H1G0438M-TCLB0
• K4H1G0438M-TCLB3
• K4H1G0438M-TLA0
• K4H1G0438M-TLA2
• K4H1G0438M-TLB0