इलेक्ट्रॉनिक पुर्ज़े : K4H280838F-ULB3

निर्माता : SAMSUNG[Samsung semiconductor]

पैकिंग :

पिन :

वर्णन : 128Mb F-die SDRAM Specification TSOP-II with Pb-Free (RoHS compliant)

तापमान : न्यूनतम °C | मैक्स °C

Datasheet : K4H280838F-ULB3 PDF

• K4H280838F-TC/LA2
• K4H280838F-TC/LB0
• K4H280838F-TC/LB3
• K4H280838F-TCLA2
• K4H280838F-TCLB0
• K4H280838F-TCLB3
• K4H280838F-UCA2
• K4H280838F-UCB0
• K4H280838F-UCB3
• K4H280838F-ULA2
• K4H280838F-ULB0
• K4H280838F-ULB3