इलेक्ट्रॉनिक पुर्ज़े : M470L2923BNV0-CB3

निर्माता : SAMSUNG[Samsung semiconductor]

पैकिंग :

पिन :

वर्णन : SDRAM Unbuffered Module Unbuffered Module based 512Mb B-die

तापमान : न्यूनतम °C | मैक्स °C

Datasheet : M470L2923BNV0-CB3 PDF

• M470L2923BN0-CA2
• M470L2923BN0-CB0
• M470L2923BN0-CB3
• M470L2923BN0-CCC
• M470L2923BN0-CLA2
• M470L2923BN0-CLB0
• M470L2923BN0-CLB3
• M470L2923BN0-CLCC
• M470L2923BNV0-CA2
• M470L2923BNV0-CB0
• M470L2923BNV0-CB3
• M470L2923BNV0-CCC
• M470L2923BNV0-CLA2
• M470L2923BNV0-CLB0
• M470L2923BNV0-CLB3